Invention Grant
- Patent Title: Polymer member based interconnect
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Application No.: US15158963Application Date: 2016-05-19
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Publication No.: US09865548B2Publication Date: 2018-01-09
- Inventor: Cyprian Emeka Uzoh , Rajesh Katkar , Charles G. Woychik , Guilian Gao , Arkalgud R. Sitaram
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/49 ; H01L21/76 ; H01L23/532 ; H01L23/522 ; H01L23/00 ; H01L21/768 ; H01L23/498 ; H01L25/065
Abstract:
An interconnect (124) suitable for attachment of integrated circuit assemblies to each other comprises a polymer member (130) which is conductive and/or is coated with a conductive material (144). Such interconnects replace metal bond wires in some embodiments. Other features are also provided.
Public/Granted literature
- US20160268205A1 POLYMER MEMBER BASED INTERCONNECT Public/Granted day:2016-09-15
Information query
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