Invention Grant
- Patent Title: Wafer level package
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Application No.: US15002749Application Date: 2016-01-21
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Publication No.: US09865552B2Publication Date: 2018-01-09
- Inventor: Han-Sung Ryu , Kyong-soon Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2015-0082569 20150611
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/29 ; H01L21/56 ; H01L23/31
Abstract:
A water level package includes a substrate, a plurality of semiconductor chips mounted on the substrate, and molding members that contact the substrate and the plurality of semiconductor chips and are formed on the substrate. The molding members include two or more molding members that have coefficients of thermal expansion (CTEs) different from each other.
Public/Granted literature
- US20160365319A1 WAFER LEVEL PACKAGE Public/Granted day:2016-12-15
Information query
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