公开(公告)号：US20200013740A1

公开(公告)日：2020-01-09

申请号：US16283906

申请日：2019-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JIN-KUK BAE ,  Hyun-Soo Chung ,  Han-Sung Ryu ,  In-Young Lee ,  Chan-Ho Lee

IPC: H01L23/00

Abstract: A semiconductor chip includes a substrate. An electrode pad is disposed on the substrate. The electrode pad includes a low-k material layer. A first protection layer at least partially surrounds the electrode pad. The first protection layer includes a first opening at an upper portion thereof. A buffer pad is electrically connected to the electrode pad. A second protection layer at least partially surrounds the buffer pad. The second protection layer includes a second opening at an upper portion thereof. A pillar layer and a solder layer are sequentially stacked on the buffer pad. A thickness of the buffer pad is greater than a thickness of the electrode pad. A width of the first opening in a first direction parallel to an upper surface of the semiconductor substrate is equal to or greater than a width of the second opening in the first direction.

公开(公告)号：US20140073079A1

公开(公告)日：2014-03-13

申请号：US14016256

申请日：2013-09-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong-Hoe Cho ,  Byoung-Rim Seo ,  Yung-Cheol Kong ,  Han-Sung Ryu

IPC: H01L27/146

CPC classification number: H01L27/14683 ,  H04N5/2252 ,  H04N5/2253 ,  Y10T29/49117

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract translation: 相机模块包括图像传感器芯片，其包括具有第一和第二相对表面的基板和在第一表面上的接地焊盘，围绕图像传感器芯片的侧面但使图像传感器芯片的第二表面露出的壳体， 与壳体结合的电磁波屏蔽膜，以及电连接到接地垫的电导体。 相机模块还具有设置在壳体中的图像传感器芯片的第一表面上的光学单元，以将来自物体的光引导到图像传感器芯片。 电导体延伸穿过壳体的一侧。 导体还与电磁波屏蔽膜接触，将接地焊盘和电磁波屏蔽膜电连接。

公开(公告)号：US10930610B2

公开(公告)日：2021-02-23

申请号：US16283906

申请日：2019-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-Kuk Bae ,  Hyun-Soo Chung ,  Han-Sung Ryu ,  In-Young Lee ,  Chan-Ho Lee

IPC: H01L23/00 ,  H01L23/48

Abstract: A semiconductor chip includes a substrate having a low-k material layer. An electrode pad is disposed the substrate. A first protection layer at least partially surrounds the electrode pad. The first protection layer includes a first opening at an upper portion thereof. A buffer pad is electrically connected to the electrode pad. A second protection layer at least partially surrounds the buffer pad. The second protection layer includes a second opening at an upper portion thereof. A pillar layer and a solder layer are sequentially stacked on the buffer pad. A thickness of the buffer pad is greater than a thickness of the electrode pad. A width of the first opening in a first direction parallel to an upper surface of the semiconductor substrate is equal to or greater than a width of the second opening in the first direction.

公开(公告)号：US09865552B2

公开(公告)日：2018-01-09

申请号：US15002749

申请日：2016-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Sung Ryu ,  Kyong-soon Cho

IPC: H01L23/00 ,  H01L23/29 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3114

Abstract: A water level package includes a substrate, a plurality of semiconductor chips mounted on the substrate, and molding members that contact the substrate and the plurality of semiconductor chips and are formed on the substrate. The molding members include two or more molding members that have coefficients of thermal expansion (CTEs) different from each other.

公开(公告)号：US08927316B2

公开(公告)日：2015-01-06

申请号：US14016256

申请日：2013-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Hoe Cho ,  Byoung-Rim Seo ,  Yung-Cheol Kong ,  Han-Sung Ryu

IPC: H01L21/00

CPC classification number: H01L27/14683 ,  H04N5/2252 ,  H04N5/2253 ,  Y10T29/49117

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract translation: 相机模块包括图像传感器芯片，其包括具有第一和第二相对表面的基板和在第一表面上的接地焊盘，围绕图像传感器芯片的侧面但使图像传感器芯片的第二表面露出的壳体， 与壳体结合的电磁波屏蔽膜，以及电连接到接地垫的电导体。 相机模块还具有设置在壳体中的图像传感器芯片的第一表面上的光学单元，以将来自物体的光引导到图像传感器芯片。 电导体延伸穿过壳体的一侧。 导体还与电磁波屏蔽膜接触，将接地焊盘和电磁波屏蔽膜电连接。