Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
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Application No.: US14779545Application Date: 2015-08-13
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Publication No.: US09865619B2Publication Date: 2018-01-09
- Inventor: Xiaoxiao Wang , Peng Du , Cong Wang
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: CN201510487278 20150810
- International Application: PCT/CN2015/086821 WO 20150813
- International Announcement: WO2017/024573 WO 20170216
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L21/02 ; H01L21/3213 ; H01L29/45 ; H01L29/66 ; H01L21/22 ; H01L21/265 ; G02F1/1368

Abstract:
An array substrate and a manufacturing method thereof are provided. The method has steps of: forming a buffer layer, a light-shading layer, and a whole semiconductor layer on a substrate; simultaneously patterning the semiconductor layer and the light-shading layer; and forming a first insulation layer, a first metal layer, a second insulation layer, a second metal layer, a flat layer, and a first transparent conductive layer on the patterned semiconductor layer.
Public/Granted literature
- US20170221928A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-08-03
Information query
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