Electronic device and housing for such devices are described and claimed. In one example a housing comprises a first end cap dimensioned to fit within a first open end of the housing and comprising a first bracket having a first cam surface positioned to engage the second surface of the printed circuit board when the first end cap is inserted into the first open end of the housing. Inserting the first end cap into the first open end of the housing causes the first cam surface to urge the printed circuit board in a direction which compresses the first heat generating component against an interior surface of the housing.