Invention Grant
- Patent Title: Multilayer ceramic electronic component and manufacturing method thereof
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Application No.: US14990742Application Date: 2016-01-07
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Publication No.: US09875849B2Publication Date: 2018-01-23
- Inventor: Jin Woo Lee , Bong Jun Juhng , Duk Hyun Chun , Won Pyo Lee , Seung Hee Yoo , Myung Jun Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: unknown Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: unknown Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0075872 20150529
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G13/00 ; H01G4/12

Abstract:
A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.
Public/Granted literature
- US20160351332A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-12-01
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