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公开(公告)号:US11355286B2
公开(公告)日:2022-06-07
申请号:US16298340
申请日:2019-03-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kyoung Jin Cha , Ji Hong Jo , Hyung Soon Kwon , Jong Hoon Kim , Jin Woo Lee
Abstract: A method of manufacturing a capacitor component includes preparing a laminate structure in which a plurality of ceramic sheets, each having an internal electrode pattern formed thereon, are layered, attaching an auxiliary member to an upper surface and a lower surface of the laminate structure, and disposing the laminate structure having the auxiliary member attached thereto on a lower mold on which jigs for blocking a length direction portion and a width direction portion of the laminate structure are disposed and compressing the laminate structure. The ceramic sheet has a thickness of 0.6 μm or less, and the auxiliary member has higher elasticity than elasticity of the lower mold.
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2.
公开(公告)号:US10373759B1
公开(公告)日:2019-08-06
申请号:US16186008
申请日:2018-11-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hye Young Choi , Jong Ho Lee , Eui Hyun Jo , Jang Yeol Lee , Jin Woo Lee , Hyun Hee Gu
Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.
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公开(公告)号:US10264680B2
公开(公告)日:2019-04-16
申请号:US15471235
申请日:2017-03-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jin Woo Lee , Jin Man Jung
Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≤BWmax−BWmin≤100 μm is satisfied.
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4.
公开(公告)号:US09642260B2
公开(公告)日:2017-05-02
申请号:US14135220
申请日:2013-12-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jin Woo Lee , Hai Joon Lee , Byoung Hwa Lee , Jin Man Jung
IPC: H01G4/30 , H01G4/228 , H01G4/06 , H01G4/232 , H01G4/005 , H01G4/248 , H05K1/16 , H05K1/18 , H01G2/06 , H05K3/34
CPC classification number: H05K1/185 , H01G2/06 , H01G4/232 , H05K3/3442 , H05K2201/10015
Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0.
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公开(公告)号:US10892101B2
公开(公告)日:2021-01-12
申请号:US16184674
申请日:2018-11-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jin Woo Lee , Hyun Hee Gu , Eui Hyun Jo , Jong Ho Lee , Eun Jin Kim , Hye Young Choi
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 μm to 1 μm, and a second plating portion disposed on the first plating portion.
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公开(公告)号:US09875849B2
公开(公告)日:2018-01-23
申请号:US14990742
申请日:2016-01-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jin Woo Lee , Bong Jun Juhng , Duk Hyun Chun , Won Pyo Lee , Seung Hee Yoo , Myung Jun Park
CPC classification number: H01G4/30 , H01G4/12 , H01G4/232 , H01G13/006
Abstract: A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.
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公开(公告)号:US09607768B2
公开(公告)日:2017-03-28
申请号:US14335613
申请日:2014-07-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Byoung Hwa Lee , Jin Man Jung , Jin Woo Lee , Eun Sang Na , Young Don Choi
CPC classification number: H01G4/30 , H01G2/065 , H01G4/012 , H01G4/12 , H05K1/181 , H05K1/185 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: A multilayer ceramic capacitor includes first through fourth internal electrodes. The first and second internal electrodes are connected to first and second external electrodes, respectively, and disposed to face each other. The third and fourth internal electrodes are connected to the first and second external electrodes, respectively, and disposed to face each other, with a connection area of the third and fourth internal electrodes with the first and second external electrodes being different from the connection area where the first and second internal electrodes connect with the first and second external electrodes. The first and second external electrodes include first and second conductive layers disposed in inner portions thereof, and first and second conductive resin layers disposed in outer portions thereof, respectively.
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公开(公告)号:US20200161052A1
公开(公告)日:2020-05-21
申请号:US16298340
申请日:2019-03-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kyoung Jin Cha , Ji Hong Jo , Hyung Soon Kwon , Jong Hoon Kim , Jin Woo Lee
Abstract: A method of manufacturing a capacitor component includes preparing a laminate structure in which a plurality of ceramic sheets, each having an internal electrode pattern formed thereon, are layered, attaching an auxiliary member to an upper surface and a lower surface of the laminate structure, and disposing the laminate structure having the auxiliary member attached thereto on a lower mold on which jigs for blocking a length direction portion and a width direction portion of the laminate structure are disposed and compressing the laminate structure. The ceramic sheet has a thickness of 0.6 μm or less, and the auxiliary member has higher elasticity than elasticity of the lower mold.
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公开(公告)号:US10580578B1
公开(公告)日:2020-03-03
申请号:US16372782
申请日:2019-04-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hye Young Choi , Jong Ho Lee , Eui Hyun Jo , Jang Yeol Lee , Jin Woo Lee , Hyun Hee Gu
Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.
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公开(公告)号:US10306765B2
公开(公告)日:2019-05-28
申请号:US15914664
申请日:2018-03-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jin Woo Lee , Jin Man Jung
IPC: H01G4/30 , H01G4/005 , H01G4/232 , H01G4/228 , H05K1/11 , H05K1/18 , H05K1/02 , H01G4/12 , H05K1/09
Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≤BWmax−BWmin≤100 μm is satisfied.
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