Invention Grant
- Patent Title: Stacked semiconductor device assembly
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Application No.: US14885173Application Date: 2015-10-16
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Publication No.: US09880959B2Publication Date: 2018-01-30
- Inventor: Scott C. Best
- Applicant: Rambus Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/60 ; H01L25/065 ; G06F13/362 ; G11C11/408 ; G11C11/409 ; H01L23/50 ; H01L23/00 ; G06F13/40 ; G11C11/4096 ; G11C14/00 ; G11C16/10 ; G11C16/26 ; H01L27/02

Abstract:
The semiconductor device system includes multiple stacked substantially identical semiconductor devices each including a first side and an opposing second side. First and second pads are disposed at the first side of the semiconductor device, while third and fourth pads are disposed at the second side of the semiconductor device. First interface circuit is electrically coupled to the first pad and the third pad, while second interface circuit is electrically coupled to the second pad and the fourth pad. The second interface circuit is separate and distinct from the first interface circuit. At least one first semiconductor device of the multiple semiconductor devices is offset from other of the multiple semiconductor devices such that the fourth pad on the first semiconductor device is aligned with, and electrically connected to, the first pad on an adjacent one of the multiple semiconductor devices. In some embodiments, the first pad is associated with a first capacitance, while the second pad is associated with a second capacitance that is smaller than the first capacitance.
Public/Granted literature
- US20160086923A1 Stacked Semiconductor Device Assembly Public/Granted day:2016-03-24
Information query
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