Invention Grant
- Patent Title: Electronic device, lid structure and package structure
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Application No.: US15291971Application Date: 2016-10-12
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Publication No.: US09881845B1Publication Date: 2018-01-30
- Inventor: Yung-Yi Chang , Hsun-Wei Chan , Ching-Han Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L23/055 ; G01N27/12 ; G01N33/00

Abstract:
An electronic device includes a transducer including a sensing area and a covering structure that covers the transducer. The covering structure includes a shelter portion and defines at least one aperture. The shelter portion covers the sensing area. The aperture includes a first curved surface and a second curved surface farther away from the sensing area than the first curved surface, and a first center of a first curvature of the first curved surface is at a different location than a second center of a second curvature of the second curved surface.
Information query
IPC分类: