Invention Grant
- Patent Title: Substrate block for PoP package
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Application No.: US14273882Application Date: 2014-05-09
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Publication No.: US09881859B2Publication Date: 2018-01-30
- Inventor: Hong Bok We , Dong Wook Kim , Jae Sik Lee , Shiqun Gu , Ratibor Radojcic
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP/Qualcomm
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/538 ; H01L23/522 ; H01L21/78 ; H01L21/56 ; H01L23/31 ; H01L25/065 ; H01L23/528 ; H01L21/311 ; H05K1/09 ; H05K1/11 ; H01L25/10 ; H01L25/00 ; H01L23/00

Abstract:
A substrate block is provided that has an increased width. The substrate block comprises two substrate bars, and the substrate bars each comprise a substrate and a plurality of filled vias through the substrate. The substrate block may be used to manufacture package substrates, and these package substrate may be incorporated into a PoP structure. The package substrate includes a carrier having a plurality of vertical interconnections and a bar coupled to the vertical interconnections.
Public/Granted literature
- US20150325509A1 SUBSTRATE BLOCK FOR PoP PACKAGE Public/Granted day:2015-11-12
Information query
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