Invention Grant
- Patent Title: Method for manufacturing laser module, and laser module package
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Application No.: US15109090Application Date: 2015-02-11
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Publication No.: US09882337B2Publication Date: 2018-01-30
- Inventor: Hyung Man Lee , Soon Seob Park
- Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- Applicant Address: KR Seongnam-si
- Assignee: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- Current Assignee: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- Current Assignee Address: KR Seongnam-si
- Agency: Hauptman Ham, LLP
- Priority: KR10-2014-0058983 20140516
- International Application: PCT/KR2015/001393 WO 20150211
- International Announcement: WO2015/174614 WO 20151119
- Main IPC: H01S3/08
- IPC: H01S3/08 ; H01S3/11 ; H01S3/02 ; H01S3/094 ; H01S3/0941 ; G02B7/18 ; H01S3/00 ; H01S3/06
Abstract:
The present invention relates to a method for manufacturing a laser module, and a laser module package, and the method for manufacturing a laser module. Rapidity, accuracy and high reliability of the manufactured module can be obtained by aligning precisely using an automated equipment, and fixing components through laser welding.
Public/Granted literature
- US20160329676A1 METHOD FOR MANUFACTURING LASER MODULE, AND LASER MODULE PACKAGE Public/Granted day:2016-11-10
Information query
