Invention Grant
- Patent Title: Miniaturized imaging apparatus for wafer edge
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Application No.: US14731861Application Date: 2015-06-05
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Publication No.: US09885671B2Publication Date: 2018-02-06
- Inventor: Paul D. Horn
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Kwan & Olynick, LLP
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/95 ; G01N21/88 ; G01N21/47

Abstract:
Disclosed are methods and apparatus for imaging a rounded edge of a sample, such as a wafer with a beveled edge. In one embodiment, the system includes a curved diffuser having an internal surface for positioning towards the rounded edge of the sample and an external surface opposite the internal surface and light sources for generating a plurality of illumination beams adjacent to a plurality of positions on the external surface of the diffuser so that the diffuser outputs uniform light onto the rounded edge of the sample at a wide range of incident angles. The system further includes a sensor for receiving light scattered from the rounded edge of the sample in response to the incident light and generating a detected signal for generating an image. These elements are partially or entirely integrated into a compact assembly.
Public/Granted literature
- US20150355106A1 MINIATURIZED IMAGING APPARATUS FOR WAFER EDGE Public/Granted day:2015-12-10
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