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公开(公告)号：US09645097B2
公开(公告)日：2017-05-09
申请号：US14741866
申请日：2015-06-17
Applicant: KLA-Tencor Corporation
Inventor： Lena Nicolaides , Ben-ming Benjamin Tsai , Prashant A. Aji , Michael Gasvoda , Stanley E. Stokowski , Guoheng Zhao , Youxian Wen , Mohan Mahadevan , Paul D. Horn , Wolfgang Vollrath , Isabella T. Lewis
CPC classification number: G01N21/9503 , G01N2201/06113 , G03F7/7085 , H01L22/12
Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
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公开(公告)号：US09885671B2
公开(公告)日：2018-02-06
申请号：US14731861
申请日：2015-06-05
Applicant: KLA-Tencor Corporation
Inventor： Paul D. Horn
CPC classification number: G01N21/9503 , G01N21/47 , G01N21/8806 , G01N2021/8816 , G01N2201/062 , G01N2201/0634 , G01N2201/068
Abstract: Disclosed are methods and apparatus for imaging a rounded edge of a sample, such as a wafer with a beveled edge. In one embodiment, the system includes a curved diffuser having an internal surface for positioning towards the rounded edge of the sample and an external surface opposite the internal surface and light sources for generating a plurality of illumination beams adjacent to a plurality of positions on the external surface of the diffuser so that the diffuser outputs uniform light onto the rounded edge of the sample at a wide range of incident angles. The system further includes a sensor for receiving light scattered from the rounded edge of the sample in response to the incident light and generating a detected signal for generating an image. These elements are partially or entirely integrated into a compact assembly.
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3.发明申请公开(公告)号：US20150370175A1
公开(公告)日：2015-12-24
申请号：US14741866
申请日：2015-06-17
Applicant: KLA-Tencor Corporation
Inventor： Lena Nicolaides , Ben-ming Benjamin Tsai , Prashant A. Aji , Michael Gasvoda , Stanley E. Stokowski , Guoheng Zhao , Youxian Wen , Mohan Mahadevan , Paul D. Horn , Wolfgang Vollrath , Isabella T. Lewis
CPC classification number: G01N21/9503 , G01N2201/06113 , G03F7/7085 , H01L22/12
Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
Abstract translation: 公开了用于检查和处理半导体晶片的方法和装置。 该系统包括边缘检测系统，用于接收将进行光刻工艺的每个晶片。 边缘检测系统包括用于将一个或多个照明光束朝向位于晶片的边界区域内的侧面，顶部和底部边缘部分引导的照明通道。 边缘检测系统还包括用于收集和感测从晶片的边缘部分散射或反射的输出辐射的收集模块和用于定位边缘部分中的缺陷的分析器模块，并且基于所感测到的每个晶片是否在规格范围内 这种晶片的输出辐射。 光刻系统被配置为从边缘检测系统接收已发现在规格范围内的每个晶片。 边缘检测系统与光刻系统成对连接。
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公开(公告)号：US20150355106A1
公开(公告)日：2015-12-10
申请号：US14731861
申请日：2015-06-05
Applicant: KLA-Tencor Corporation
Inventor： Paul D. Horn
CPC classification number: G01N21/9503 , G01N21/47 , G01N21/8806 , G01N2021/8816 , G01N2201/062 , G01N2201/0634 , G01N2201/068
Abstract: Disclosed are methods and apparatus for imaging a rounded edge of a sample, such as a wafer with a beveled edge. In one embodiment, the system includes a curved diffuser having an internal surface for positioning towards the rounded edge of the sample and an external surface opposite the internal surface and light sources for generating a plurality of illumination beams adjacent to a plurality of positions on the external surface of the diffuser so that the diffuser outputs uniform light onto the rounded edge of the sample at a wide range of incident angles. The system further includes a sensor for receiving light scattered from the rounded edge of the sample in response to the incident light and generating a detected signal for generating an image. These elements are partially or entirely integrated into a compact assembly.
Abstract translation: 公开了用于对样品的圆形边缘成像的方法和装置，例如具有斜边的晶片。 在一个实施例中，系统包括弯曲扩散器，其具有用于朝向样品的圆形边缘定位的内表面和与内表面相对的外表面和用于产生与外部多个位置相邻的多个照明光束的光源 扩散器的表面，使得漫射器在宽的入射角范围内将均匀的光输出到样品的圆形边缘上。 该系统还包括用于响应入射光接收从样品的圆形边缘散射的光并产生用于产生图像的检测信号的传感器。 这些元件部分或完全集成到紧凑的组件中。
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