Invention Grant
- Patent Title: Connectivity of slave devices in mobile devices
-
Application No.: US14213173Application Date: 2014-03-14
-
Publication No.: US09886407B2Publication Date: 2018-02-06
- Inventor: Daniel Kehrer
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/38 ; H04B1/00

Abstract:
In accordance with an embodiment of the present invention, a chip set for a mobile device includes a slave device chip and an interface circuit chip that includes a slave bus interface for controlling the slave device chip through an analog bus. The slave bus interface is coupled to a master bus interface via a digital bus of the mobile device. The slave bus interface is configured to be driven by the master bus interface.
Public/Granted literature
- US20150261708A1 Connectivity of Slave Devices in Mobile Devices Public/Granted day:2015-09-17
Information query