- 专利标题: Light emitting device including a resin package having a cavity
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申请号: US15494863申请日: 2017-04-24
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公开(公告)号: US09887335B2公开(公告)日: 2018-02-06
- 发明人: Takuya Nakabayashi , Yoshitaka Bando , Hiroto Tamaki
- 申请人: NICHIA CORPORATION
- 申请人地址: JP Anan-shi
- 专利权人: Nichia Corporation
- 当前专利权人: Nichia Corporation
- 当前专利权人地址: JP Anan-shi
- 代理机构: Global IP Counselors, LLP
- 优先权: JP2013-043543 20130305; JP2013-043551 20130305
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L33/62 ; H01L33/48
摘要:
A light emitting device includes a resin package and a light emitting element. The resin package has a cavity. The resin package includes first and second lead portions and a resin member. The first lead portion includes a first lead side surface and a lead recess portion that extends from the first lead side surface in a direction away from the second lead portion, with a part of the resin member being arranged within the lead recess portion. The light emitting element includes first and second electrodes that respectively face the first and second lead portions. The first electrode includes a first electrode side surface and an electrode recess portion that extends from the first electrode side surface in a direction away from the second electrode. The electrode recess portion is arranged at a position overlapping the lead recess portion in a plan view.
公开/授权文献
- US20170229628A1 LEAD FRAME AND SEMICONDUCTOR DEVICE 公开/授权日:2017-08-10
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