Invention Grant
- Patent Title: Light emitting device including a resin package having a cavity
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Application No.: US15494863Application Date: 2017-04-24
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Publication No.: US09887335B2Publication Date: 2018-02-06
- Inventor: Takuya Nakabayashi , Yoshitaka Bando , Hiroto Tamaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2013-043543 20130305; JP2013-043551 20130305
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L33/62 ; H01L33/48

Abstract:
A light emitting device includes a resin package and a light emitting element. The resin package has a cavity. The resin package includes first and second lead portions and a resin member. The first lead portion includes a first lead side surface and a lead recess portion that extends from the first lead side surface in a direction away from the second lead portion, with a part of the resin member being arranged within the lead recess portion. The light emitting element includes first and second electrodes that respectively face the first and second lead portions. The first electrode includes a first electrode side surface and an electrode recess portion that extends from the first electrode side surface in a direction away from the second electrode. The electrode recess portion is arranged at a position overlapping the lead recess portion in a plan view.
Public/Granted literature
- US20170229628A1 LEAD FRAME AND SEMICONDUCTOR DEVICE Public/Granted day:2017-08-10
Information query
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