A production method for an electronic component using an exterior packaging material containing a silicone resin comprises a step of dipping an element into an exterior packaging material containing a silicone resin to which aluminum hydroxide or magnesium hydroxide and a nonpolar solvent are added, an additive amount of the aluminum hydroxide or the magnesium hydroxide being controlled to a range of 60 [wt. %] or more to less than 70 [wt. %], a step of drying the exterior packaging material formed on a surface of the element to evaporate the nonpolar solvent and cause a silicone resin component to appear on a surface of the exterior packaging material, and a curing step of curing the exterior packaging material.