公开(公告)号：US09892830B2

公开(公告)日：2018-02-13

申请号：US15150903

申请日：2016-05-10

Applicant: NIPPON CHEMI-CON CORPORATION

Inventor： Shogo Aizawa

IPC: H01C17/02 ,  H01C1/034 ,  H01C7/102 ,  C09D7/12 ,  H01C7/10 ,  C08K3/22

CPC classification number: H01C17/02 ,  C08K3/22 ,  C08K2003/2224 ,  C08K2003/2227 ,  C09D7/61 ,  H01C1/034 ,  H01C7/10 ,  H01C7/1006 ,  H01C7/102

Abstract: A production method for an electronic component using an exterior packaging material containing a silicone resin comprises a step of dipping an element into an exterior packaging material containing a silicone resin to which aluminum hydroxide or magnesium hydroxide and a nonpolar solvent are added, an additive amount of the aluminum hydroxide or the magnesium hydroxide being controlled to a range of 60 [wt. %] or more to less than 70 [wt. %], a step of drying the exterior packaging material formed on a surface of the element to evaporate the nonpolar solvent and cause a silicone resin component to appear on a surface of the exterior packaging material, and a curing step of curing the exterior packaging material.

公开(公告)号：US20160254081A1

公开(公告)日：2016-09-01

申请号：US15150903

申请日：2016-05-10

Applicant: NIPPON CHEMI-CON CORPORATION

Inventor： Shogo Aizawa

IPC: H01C17/02 ,  C09D7/12 ,  H01C1/034 ,  H01C7/10

CPC classification number: H01C17/02 ,  C08K3/22 ,  C08K2003/2224 ,  C08K2003/2227 ,  C09D7/61 ,  H01C1/034 ,  H01C7/10 ,  H01C7/1006 ,  H01C7/102

Abstract: A production method for an electronic component using an exterior packaging material containing a silicone resin comprises a step of dipping an element into an exterior packaging material containing a silicone resin to which aluminum hydroxide or magnesium hydroxide and a nonpolar solvent are added, an additive amount of the aluminum hydroxide or the magnesium hydroxide being controlled to a range of 60 [wt. %] or more to less than 70 [wt. %], a step of drying the exterior packaging material formed on a surface of the element to evaporate the nonpolar solvent and cause a silicone resin component to appear on a surface of the exterior packaging material, and a curing step of curing the exterior packaging material.

Abstract translation: 使用含有硅酮树脂的外部包装材料的电子部件的制造方法包括将元件浸渍到含有添加了氢氧化铝或氢氧化镁和非极性溶剂的有机硅树脂的外部包装材料的添加量 将氢氧化铝或氢氧化镁控制在60 [wt。 ％]以上至小于70 [wt。 ％），干燥形成在元件表面上的外包装材料的步骤，蒸发非极性溶剂，并使有机硅树脂成分出现在外包装材料的表面上;固化步骤，使外包装材料固化 。