One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.