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公开(公告)号：US09894816B2
公开(公告)日：2018-02-13
申请号：US15115868
申请日：2015-02-04
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Tetsuo Saji , Yohei Ichikawa , Hiroshi Nakamura
CPC classification number: H05K9/0024 , H01L23/00 , H01L23/28 , H01L23/3121 , H01L23/552 , H01L2924/0002 , H05K1/0216 , H05K1/185 , H05K2201/10371 , H05K2201/10522 , H01L2924/00
Abstract: One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.
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公开(公告)号：US09160825B2
公开(公告)日：2015-10-13
申请号：US14481779
申请日：2014-09-09
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo Saji , Yohei Ichikawa , Hiroshi Nakamura
CPC classification number: H04M1/026 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/73267 , H01L2924/0002 , H01L2924/19105 , H04B1/38 , H04B1/3888 , H04B15/02 , H04B15/04 , H05K1/0218 , H05K1/0243 , H05K3/284 , H05K9/0022 , H05K9/0045 , H05K2201/0715 , H05K2201/10371 , H01L2924/00
Abstract: A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.
Abstract translation: 通信模块包括具有与移动电话通信相关的第一高频处理部分的电路基板，处理与卫星定位系统相关的接收信号的第二高频处理部分，具有基带处理部分和应用处理部分的系统部分 以及电源电路部，覆盖安装在电路基板上的电子部件的密封部件，形成在密封部件的表面上的导电性屏蔽层和形成在密封部件中的屏蔽壁， 第一高频处理部和第二高频处理部的安装区域。
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公开(公告)号：US08849362B1
公开(公告)日：2014-09-30
申请号：US14199824
申请日：2014-03-06
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Tetsuo Saji , Yohei Ichikawa , Hiroshi Nakamura
IPC: H04M1/00 , H04M1/02 , H01L23/552
CPC classification number: H04B15/04 , H01L2224/16227 , H01L2924/0002 , H01L2924/3025 , H04B1/3888 , H05K1/0218 , H05K3/284 , H05K2201/0715 , H05K2201/10371 , H01L2924/00
Abstract: A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate one or both mounting areas of the system section and power circuit section and the mounting area of the first high-frequency processing section. The circuit substrate includes a core layer that is a conductive layer thicker than the other conductive layers and that functions as a ground. Electronic components are arranged in through-holes formed in the core layer.
Abstract translation: 通信模块包括具有与移动电话通信相关的第一高频处理部分的电路基板，具有基带处理部分和应用处理部分的系统部分，以及电源电路部分，覆盖安装在所述电子部件上的电子部件的密封部件 电路基板，形成在密封构件的表面上的导电屏蔽层和形成在密封构件中的屏蔽壁，以便划分系统部分和电源电路部分的一个或两个安装区域以及第一高度的安装区域 频率处理部分。 电路基板包括芯层，该芯层是比其他导电层更厚的导电层，并且用作接地。 电子部件布置在形成在芯层中的通孔中。
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