A cooling system for a hot gas path component includes a substrate having an outer surface and an inner surface. The inner surface defines at least one interior space. A passage is formed in the substrate between the outer surface and the inner surface. An access passage is formed in the substrate and extends from the outer surface to the inner space. The access passage is formed at a first acute angle to the passage and includes a particle collection chamber. The access passage is configured to channel a cooling fluid to the passage. Furthermore, the passage is configured to channel the cooling fluid therethrough to cool the substrate.