Invention Grant
- Patent Title: Method for producing a semi-conductor arrangement and corresponding semi-conductor arrangement
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Application No.: US15514304Application Date: 2015-07-08
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Publication No.: US09905533B2Publication Date: 2018-02-27
- Inventor: Günter Vetter , Andreas Apelsmeier , Henning Suckel
- Applicant: AUDI AG
- Applicant Address: DE Ingolstadt
- Assignee: AUDI AG
- Current Assignee: AUDI AG
- Current Assignee Address: DE Ingolstadt
- Agency: Henry M. Feiereisen LLC
- Priority: DE102014014473 20140927
- International Application: PCT/EP2015/001393 WO 20150708
- International Announcement: WO2016/045758 WO 20160331
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00 ; H01L21/48 ; H01L23/492
Abstract:
A method for producing a semiconductor arrangement, said method includes fastening a semiconductor on a base element by means of a sintered layer, wherein a side of the sintered layer which faces the base element is configured planar; and perforating a region of the base element, which directly contacts the sinter, wherein the perforating includes generating a plurality of through-openings having a closed border in the region of the base element for adjusting a stiffness of at least a portion of the base element in a targeted manner
Public/Granted literature
- US20170278822A1 METHOD FOR PRODUCING A SEMI-CONDUCTOR ARRANGEMENT AND CORRESPONDING SEMI-CONDUCTOR ARRANGEMENT Public/Granted day:2017-09-28
Information query
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