Invention Grant
- Patent Title: Semiconductor integrated circuit layout structure
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Application No.: US15484126Application Date: 2017-04-10
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Publication No.: US09905562B2Publication Date: 2018-02-27
- Inventor: Shih-Chin Lin , Kuei-Chun Hung , Jerry Che Jen Hu , Ming-Jui Chen , Chen-Hsien Hsu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW104125572A 20150806
- Main IPC: H01L27/118
- IPC: H01L27/118 ; H01L27/092 ; H01L27/02 ; H01L29/06 ; H01L27/088 ; H01L23/522 ; H01L23/528 ; H01L21/285 ; H01L21/8238 ; H01L29/49

Abstract:
A semiconductor IC layout structure includes a plurality of first active regions arranged along a second direction, a plurality of second active regions arranged along the second direction, a plurality of gate structures extending along a first direction and respectively straddling the first active regions and the second active regions, a plurality of first conductive structures extending along the first direction, and a plurality of second conductive structures formed on the gate structures. The second active regions are isolated from the first active regions. The first direction is perpendicular to the second direction. The first conductive structures are formed on the first active regions and the second active regions. The second conductive structures include a plurality of slot-type second conductive structures extended along the second direction and a plurality of island-type second conductive structures formed on the gate structures.
Public/Granted literature
- US20170221897A1 SEMICONDUCTOR INTEGRATED CIRCUIT LAYOUT STRUCTURE Public/Granted day:2017-08-03
Information query
IPC分类: