Invention Grant
- Patent Title: Heat module
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Application No.: US14617203Application Date: 2015-02-09
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Publication No.: US09909813B2Publication Date: 2018-03-06
- Inventor: Takehito Tamaoka , Kazuhiko Fukushima , Koji Hatanaka
- Applicant: NIDEC CORPORATION
- Applicant Address: JP Kyoto
- Assignee: NIDEC CORPORATION
- Current Assignee: NIDEC CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-122755 20140613
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/02 ; G06F1/20

Abstract:
A heat module includes a fan and a heat pipe. A flat portion of the heat pipe includes a recessed portion being recessed toward a center of the heat pipe in a cross section. A heat receiving portion arranged between the heat source and the heat pipe includes a heat source contact portion arranged to be in thermal contact with the heat pipe. In at least a portion of the heat pipe which extends between a portion of the heat pipe which is in thermal contact with the fan contact portion and a portion of the heat pipe which is in thermal contact with the heat source contact portion, a difference between a maximum axial height of the heat pipe and a minimum axial height of a portion of the heat pipe where the recessed portion is defined is smaller than a wall thickness of the recessed portion.
Public/Granted literature
- US20150362258A1 HEAT MODULE Public/Granted day:2015-12-17
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