Invention Grant
- Patent Title: Method and structure for receiving a micro device
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Application No.: US15405042Application Date: 2017-01-12
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Publication No.: US09911722B2Publication Date: 2018-03-06
- Inventor: John A. Higginson , Andreas Bibl , Hsin-Hua Hu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Rutan & Tucker, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L25/16 ; H01L25/00 ; H01L23/31 ; H01L25/075 ; H01L27/12 ; H01L33/06 ; H01L33/62 ; H01L33/54 ; H01L33/42
Abstract:
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
Public/Granted literature
- US20170125391A1 METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE Public/Granted day:2017-05-04
Information query
IPC分类:
