Invention Grant
- Patent Title: Magnetic small footprint inductor array module for on-package voltage regulator
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Application No.: US14974978Application Date: 2015-12-18
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Publication No.: US09911723B2Publication Date: 2018-03-06
- Inventor: Yongki Min , Reynaldo A. Olmedo , William J. Lambert , Kaladhar Radhakrishnan , Leigh E. Wojewoda , Venkat Anil K. Magadala , Clive R. Hendricks
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/00 ; H01L23/498 ; H01L23/522 ; H01L25/065 ; H01L25/16 ; H01F17/00

Abstract:
An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
Public/Granted literature
- US20170179094A1 MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTAGE REGULATOR Public/Granted day:2017-06-22
Information query
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