公开(公告)号：US10741536B2

公开(公告)日：2020-08-11

申请号：US16426939

申请日：2019-05-30

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01F17/00 ,  H01L23/64 ,  H01L23/498 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

公开(公告)号：US20190279973A1

公开(公告)日：2019-09-12

申请号：US16426939

申请日：2019-05-30

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadla ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01L25/16 ,  H01L23/64 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065 ,  H01F17/00 ,  H01L23/00

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material: a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

公开(公告)号：US10340260B2

公开(公告)日：2019-07-02

申请号：US15911958

申请日：2018-03-05

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01F17/00 ,  H01L23/498 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16 ,  H01L23/64

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

公开(公告)号：US20180197845A1

公开(公告)日：2018-07-12

申请号：US15911958

申请日：2018-03-05

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01L25/065 ,  H01F17/00 ,  H01L23/498 ,  H01L23/522 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01F17/00 ,  H01F17/0006 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/06 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16265 ,  H01L2924/1427 ,  H01L2924/143 ,  H01L2924/19011 ,  H01L2924/19042

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

公开(公告)号：US09911723B2

公开(公告)日：2018-03-06

申请号：US14974978

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065 ,  H01L25/16 ,  H01F17/00

CPC classification number: H01L25/18 ,  H01F17/00 ,  H01F17/0006 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L24/06 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16265 ,  H01L2924/1427 ,  H01L2924/143 ,  H01L2924/19011 ,  H01L2924/19042

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.