A method for preparing a surface of a substrate for bonding a material to the surface. The apparatus employed includes one or more optical amplification devices (OAD), one or more drivers, the substrate and a base. The one or more OAD and/or the substrate are moveably coupled to the one or more drivers. The one or more OAD is activated to emit a beam of energy. The one or more OAD and/or the substrate move relative to one another while the one or more OAD is activated. The movement of the one or more OAD and/or the substrate relative to one another forms (via the beam of energy) a pattern on the surface of the substrate. The pattern formed on the surface of the substrate allows the material to bond with a greater degree of adhesion.