Invention Grant
- Patent Title: Semiconductor package having a leadframe with multi-level assembly pads
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Application No.: US14973927Application Date: 2015-12-18
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Publication No.: US09922908B2Publication Date: 2018-03-20
- Inventor: Chia-Yu Chang , Chih-Chien Ho , Steven Su
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/00 ; H05K7/18 ; H01L23/31 ; H01L23/13 ; H01L23/00

Abstract:
A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (133) to the second pad.
Public/Granted literature
- US20170179007A1 SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH MULTI-LEVEL ASSEMBLY PADS Public/Granted day:2017-06-22
Information query
IPC分类: