Invention Grant
- Patent Title: Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same
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Application No.: US15257723Application Date: 2016-09-06
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Publication No.: US09922938B2Publication Date: 2018-03-20
- Inventor: Ming-Horng Tsai , Wei-Yu Chen , Chun-Chia Lee , Huan Wun Li
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaosiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaosiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/552 ; H01L23/498 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/538 ; H01L23/64 ; H02J50/10 ; H01L25/065 ; H02J7/02 ; H01L23/04
Abstract:
The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component disposed on the carrier, and a package body disposed on the carrier and encapsulating the electronic component. A shield is disposed on the package body. The shield includes multiple non-magnetic conductive layers, multiple insulating layers and multiple magnetic conductive layers. At least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer.
Public/Granted literature
Information query
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