公开(公告)号：US10756025B2

公开(公告)日：2020-08-25

申请号：US16058844

申请日：2018-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan Lee ,  Jaw-Ming Ding ,  Wei-Yu Chen

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor package device includes: (1) a substrate having a top surface; (2) a passive component disposed on the substrate and having a top surface; (3) an active component disposed on the substrate and having a top surface; and (4) a package body disposed on the substrate, the package body including a first portion covering the active component and the passive component, and a second portion covering the passive component, wherein a top surface of the second portion of the package body is higher than a top surface of the first portion of the package body, and the first portion and the second portion of the package body include different materials.

公开(公告)号：US09922938B2

公开(公告)日：2018-03-20

申请号：US15257723

申请日：2016-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Horng Tsai ,  Wei-Yu Chen ,  Chun-Chia Lee ,  Huan Wun Li

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/64 ,  H02J50/10 ,  H01L25/065 ,  H02J7/02 ,  H01L23/04

CPC classification number: H01L23/552 ,  H01L21/4817 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/04 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02J7/025 ,  H02J50/10 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00

Abstract: The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component disposed on the carrier, and a package body disposed on the carrier and encapsulating the electronic component. A shield is disposed on the package body. The shield includes multiple non-magnetic conductive layers, multiple insulating layers and multiple magnetic conductive layers. At least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer.

公开(公告)号：US20170025363A1

公开(公告)日：2017-01-26

申请号：US15257723

申请日：2016-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Horng Tsai ,  Wei-Yu Chen ,  Chun-Chia Lee ,  Huan Wun Li

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H02J50/10 ,  H01L23/64 ,  H01L21/48 ,  H01L21/56 ,  H02J7/02 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/4817 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/04 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02J7/025 ,  H02J50/10 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00

Abstract: The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component disposed on the carrier, and a package body disposed on the carrier and encapsulating the electronic component. A shield is disposed on the package body. The shield includes multiple non-magnetic conductive layers, multiple insulating layers and multiple magnetic conductive layers. At least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer.

Abstract translation: 本公开涉及一种半导体器件封装，其包括载体，设置在载体上的电子部件和设置在载体上并封装电子部件的封装体。 屏蔽件设置在包装体上。 屏蔽包括多个非磁性导电层，多个绝缘层和多个导电层。 至少一个绝缘层位于每个非磁性导电层和相邻的导电层之间。

公开(公告)号：US10068854B2

公开(公告)日：2018-09-04

申请号：US15333008

申请日：2016-10-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan Lee ,  Jaw-Ming Ding ,  Wei-Yu Chen

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/60 ,  H01L27/32 ,  H01L23/552 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package device includes a substrate, a passive component, an active component and a package body. The passive component is disposed on the substrate. The active component is disposed on the substrate. The package body is disposed on the substrate. The package body includes a first portion covering the active component and the passive component, and a second portion covering the passive component. A top surface of the second portion of the package body is higher than a top surface of the first portion of the package body.

公开(公告)号：US09461001B1

公开(公告)日：2016-10-04

申请号：US14805847

申请日：2015-07-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Horng Tsai ,  Wei-Yu Chen ,  Chun-Chia Lee ,  Huan Wun Li

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L21/52 ,  H01L21/26 ,  H01L21/768 ,  H01L23/04 ,  H01L23/64 ,  H01L21/48 ,  H01L21/56 ,  H02J7/02

CPC classification number: H01L23/552 ,  H01L21/4817 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/04 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02J7/025 ,  H02J50/10 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00

Abstract: The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component, conductive elements, a package body, a shield, a magnetic insulating layer, and a patterned conductive layer. The carrier has a top surface on which the electronic component is disposed. The conductive elements are disposed on the top surface of the carrier. The package body is disposed on the top surface of the carrier and encapsulates the electronic component and a portion of each of the conductive elements. The shield is disposed on the package body and covers an exterior of the package body. The magnetic insulating layer is disposed on a top surface of the shield. The patterned conductive layer is disposed on the magnetic insulating layer. Each of the conductive elements electrically connects the patterned conductive layer to the electronic component.

Abstract translation: 本公开涉及一种半导体器件封装，其包括载体，电子部件，导电元件，封装体，屏蔽层，磁性绝缘层和图案化导电层。 载体具有设置有电子部件的顶面。 导电元件设置在载体的顶表面上。 封装体设置在载体的顶表面上并封装电子部件和每个导电元件的一部分。 屏蔽件设置在封装体上并覆盖封装主体的外部。 磁绝缘层设置在屏蔽的顶表面上。 图案化导电层设置在磁绝缘层上。 每个导电元件将图案化的导电层电连接到电子部件。