- 专利标题: Wide bandgap semiconductor device
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申请号: US15221122申请日: 2016-07-27
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公开(公告)号: US09923066B2公开(公告)日: 2018-03-20
- 发明人: Daniel Kueck , Thomas Aichinger , Franz Hirler , Anton Mauder
- 申请人: Infineon Technologies AG
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Volpe and Koenig, P.C.
- 优先权: DE102015215024 20150806
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L29/78 ; H01L29/739 ; H01L29/10 ; H01L29/423 ; H01L29/06 ; H01L29/16 ; H01L29/20
摘要:
A semiconductor device includes a source zone electrically connected to a first load terminal, a contiguous zone isolating the source zone from a drift zone, and a trench extending into a semiconductor body along a vertical direction and including a first electrode electrically connected to a control terminal and an insulator in contact with the contiguous zone and which isolates the first electrode from the semiconductor body. The insulator has, at a trench bottom region, a first thickness along the vertical direction, and, at a trench top region, a second thickness along a lateral direction, the first thickness being greater than the second thickness by a factor of at least 1.5. The contiguous zone is arranged in contact with the insulator and extends further along the vertical direction than the trench, and the trench bottom region and the contiguous zone overlap along the lateral direction.
公开/授权文献
- US20170040425A1 WIDE BANDGAP SEMICONDUCTOR DEVICE 公开/授权日:2017-02-09
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