Invention Grant
- Patent Title: Image sensor assembly, method of manufacturing the same, and camera module
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Application No.: US15095419Application Date: 2016-04-11
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Publication No.: US09929195B2Publication Date: 2018-03-27
- Inventor: Kang Hyun Lee , Sung Min Song , Jung Gon Choi , Heung Woo Park , Jae Hyun Lim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0121070 20150827
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.
Public/Granted literature
- US20170062503A1 IMAGE SENSOR ASSEMBLY, METHOD OF MANUFACTURING THE SAME, AND CAMERA MODULE Public/Granted day:2017-03-02
Information query
IPC分类: