A through wiring substrate comprises a substrate having a pair of principal surfaces and a through hole penetrating between the pair of principal surfaces, the pair of principal surfaces and an inner surface of the through hole being electrically insulative; a through electrode provided on the inner surface of the through hole; a first wiring layer provided on one of the principal surfaces and connected to the through electrode; a second wiring layer provided on the other of the principal surfaces and connected to the through electrode; an underlying metal layer provided between the one of the principal surfaces and the first wiring layer; and catalyst metal particles existing between the underlying metal layer and the first wiring layer and between the through electrode and the inner surface of the through hole.