公开(公告)号：US09930779B2

公开(公告)日：2018-03-27

申请号：US15581606

申请日：2017-04-28

Applicant: TDK CORPORATION

Inventor： Kenichi Yoshida ,  Tatsuya Harada

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/42 ,  H05K3/16

CPC classification number: H05K1/115 ,  C23C28/02 ,  H01L21/768 ,  H01L23/147 ,  H01L23/48 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/16 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0317 ,  H05K2201/09563 ,  H05K2201/0959

Abstract: A through wiring substrate comprises a substrate having a pair of principal surfaces and a through hole penetrating between the pair of principal surfaces, the pair of principal surfaces and an inner surface of the through hole being electrically insulative; a through electrode provided on the inner surface of the through hole; a first wiring layer provided on one of the principal surfaces and connected to the through electrode; a second wiring layer provided on the other of the principal surfaces and connected to the through electrode; an underlying metal layer provided between the one of the principal surfaces and the first wiring layer; and catalyst metal particles existing between the underlying metal layer and the first wiring layer and between the through electrode and the inner surface of the through hole.