- 专利标题： Wedge bonding tools, wedge bonding systems, and related methods
-
申请号： US15409172申请日： 2017-01-18
-
公开(公告)号： US09931709B2公开(公告)日： 2018-04-03
- 发明人: Dominick A. DeAngelis
- 申请人： ORTHODYNE ELECTRONICS CORPORATION
- 申请人地址： US DE Wilmington
- 专利权人： Orthodyne Electronics Corporation
- 当前专利权人： Orthodyne Electronics Corporation
- 当前专利权人地址： US DE Wilmington
- 代理商 Christopher M. Spletzer, Sr.
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; B23K20/10 ; H01L23/00 ; B23K20/00
摘要：
A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
公开/授权文献
信息查询
IPC分类:
