- 专利标题： Polishing pad with foundation layer and polishing surface layer
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申请号： US14732497申请日： 2015-06-05
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公开(公告)号： US09931728B2公开(公告)日： 2018-04-03
- 发明人: William C. Allison , Diane Scott , Paul Andre Lefevre , James P. LaCasse , Alexander William Simpson
- 申请人： NexPlanar Corporation
- 申请人地址： US IL Aurora
- 专利权人： Cabot Microelectronics Corporation
- 当前专利权人： Cabot Microelectronics Corporation
- 当前专利权人地址： US IL Aurora
- 代理商 Thomas Omholt; Erika S. Wilson
- 主分类号： B24B37/24
- IPC分类号： B24B37/24 ; B24B37/26 ; B24B37/16 ; B24D11/00 ; B24D18/00 ; B24B37/20 ; B24B37/22
摘要：
Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
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