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公开(公告)号：US09597770B2
公开(公告)日：2017-03-21
申请号：US14550129
申请日：2014-11-21
发明人： William C. Allison , Diane Scott , Rajeev Bajaj
CPC分类号： B24B37/205 , B24B37/005 , B24B37/22 , B24B37/26 , B24B49/12 , B24D18/0009
摘要： Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
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2.发明申请POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS HAVING TAPERED SIDEWALLS 审中-公开具有抛光表面的抛光垫与带有切割面的连续抛光公开(公告)号：US20140273777A1
公开(公告)日：2014-09-18
申请号：US13829990
申请日：2013-03-14
发明人： Paul Andre Lefevre , William C. Allison , Alexander William Simpson , Diane Scott , Ping Huang , Leslie M. Charns , James Richard Rinehart , Robert Kerprich
IPC分类号： B24B37/26
CPC分类号： B24B37/26
摘要： Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
摘要翻译： 描述具有具有锥形侧壁的连续突起的抛光表面的抛光垫。 还描述了制造具有具有具有锥形侧壁的连续突起的抛光表面的抛光垫的方法。
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公开(公告)号：US09597777B2
公开(公告)日：2017-03-21
申请号：US14152792
申请日：2014-01-10
IPC分类号： B24D11/00 , B24B37/013 , B24B37/20
CPC分类号： B24D11/003 , B24B37/013 , B24B37/205
摘要： Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
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公开(公告)号：US20140123563A1
公开(公告)日：2014-05-08
申请号：US14152792
申请日：2014-01-10
IPC分类号： B24D11/00
CPC分类号： B24D11/003 , B24B37/013 , B24B37/205
摘要： Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
摘要翻译： 描述了使用涡流端点检测来研磨半导体衬底的均匀抛光垫。 还描述了使用涡流端点检测来制造用于抛光半导体衬底的均匀抛光垫的方法。
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公开(公告)号：US10946495B2
公开(公告)日：2021-03-16
申请号：US14611064
申请日：2015-01-30
发明人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
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6.发明授权公开(公告)号：US10160092B2
公开(公告)日：2018-12-25
申请号：US13829990
申请日：2013-03-14
发明人： Paul Andre Lefevre , William C. Allison , Alexander William Simpson , Diane Scott , Ping Huang , Leslie M. Charns , James Richard Rinehart , Robert Kerprich
摘要： Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
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公开(公告)号：US09931729B2
公开(公告)日：2018-04-03
申请号：US14727586
申请日：2015-06-01
摘要： Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.
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公开(公告)号：US20150038066A1
公开(公告)日：2015-02-05
申请号：US13955398
申请日：2013-07-31
发明人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.
摘要翻译： 描述低密度抛光垫和制造低密度抛光垫的方法。 在一个实例中，用于抛光衬底的抛光垫包括密度小于0.5g / cc并由热固性聚氨酯材料组成的抛光体。 多个闭孔细孔分散在热固性聚氨酯材料中。
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公开(公告)号：US10293459B2
公开(公告)日：2019-05-21
申请号：US15479779
申请日：2017-04-05
发明人： Paul Andre Lefevre , William C. Allison , Alexander William Simpson , Diane Scott , Ping Huang , Leslie M. Charns , James Richard Rinehart , Robert Kerprich
摘要： Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
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公开(公告)号：US09931728B2
公开(公告)日：2018-04-03
申请号：US14732497
申请日：2015-06-05
发明人： William C. Allison , Diane Scott , Paul Andre Lefevre , James P. LaCasse , Alexander William Simpson
CPC分类号： B24B37/24 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/26 , B24D11/001 , B24D18/0009
摘要： Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
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