Invention Grant
- Patent Title: Bispecific antigen binding protein complex and preparation methods of bispecific antibodies
-
Application No.: US14069091Application Date: 2013-10-31
-
Publication No.: US09932412B2Publication Date: 2018-04-03
- Inventor: Min-kyung Kim , JungWook Lee , SuJeong Hwang , Jaeil Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: KR10-2012-0122559 20121031
- Main IPC: C07K16/46
- IPC: C07K16/46 ; C07K16/22 ; C07K16/28

Abstract:
A bispecific antigen binding protein complex comprising a first polypeptide comprising a first antigen binding site at an N terminus; a second polypeptide comprising a second antigen binding site at an N terminus; and a linker connecting the first polypeptide and the second polypeptide; wherein the linker comprises a tag at one terminus thereof, and wherein the tag is connected to a C-terminus of the first polypeptide or to an N-terminus of the second polypeptide, and comprises a cleavable amino acid sequence; as well as related compositions and methods.
Public/Granted literature
- US20140127210A1 BISPECIFIC ANTIGEN BINDING PROTEIN COMPLEX AND PREPARATION METHODS OF BISPECIFIC ANTIBODIES Public/Granted day:2014-05-08
Information query