公开(公告)号：US09932412B2

公开(公告)日：2018-04-03

申请号：US14069091

申请日：2013-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-kyung Kim ,  JungWook Lee ,  SuJeong Hwang ,  Jaeil Lee

IPC: C07K16/46 ,  C07K16/22 ,  C07K16/28

CPC classification number: C07K16/468 ,  C07K16/22 ,  C07K16/2863 ,  C07K2317/569 ,  C07K2319/50

Abstract: A bispecific antigen binding protein complex comprising a first polypeptide comprising a first antigen binding site at an N terminus; a second polypeptide comprising a second antigen binding site at an N terminus; and a linker connecting the first polypeptide and the second polypeptide; wherein the linker comprises a tag at one terminus thereof, and wherein the tag is connected to a C-terminus of the first polypeptide or to an N-terminus of the second polypeptide, and comprises a cleavable amino acid sequence; as well as related compositions and methods.