Invention Grant
- Patent Title: Component mounting method
-
Application No.: US14807970Application Date: 2015-07-24
-
Publication No.: US09936620B2Publication Date: 2018-04-03
- Inventor: Taisuke Mori , Kenji Kamakura , Hideaki Kato
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2014-152550 20140728
- Main IPC: H05K13/02
- IPC: H05K13/02 ; B23P17/04 ; H05K13/04

Abstract:
A component mounting apparatus includes a component supply device that intermittently feeds a carrier tape, in which components are stored in a plurality of pockets formed with a uniform pitch, based on a predetermined feed pitch to supply the components stored in the pockets to a component suction position, and picks up the components supplied to the component suction position to mount the components onto a board, an imaging unit that images the pockets, and a control unit that measures a formation pitch of the pockets based on obtained image data, and changes a feed pitch of the carrier tape from the predetermined feed pitch to the formation pitch of the pockets when the measured formation pitch of the pockets and the predetermined feed pitch are different from each other, and the component supply device intermittently feeds the carrier tape based on the changed feed pitch.
Public/Granted literature
- US20160029521A1 COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD Public/Granted day:2016-01-28
Information query