公开(公告)号：US09936620B2

公开(公告)日：2018-04-03

申请号：US14807970

申请日：2015-07-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Taisuke Mori ,  Kenji Kamakura ,  Hideaki Kato

IPC: H05K13/02 ,  B23P17/04 ,  H05K13/04

CPC classification number: H05K13/0417 ,  H05K13/0419 ,  H05K13/081

Abstract: A component mounting apparatus includes a component supply device that intermittently feeds a carrier tape, in which components are stored in a plurality of pockets formed with a uniform pitch, based on a predetermined feed pitch to supply the components stored in the pockets to a component suction position, and picks up the components supplied to the component suction position to mount the components onto a board, an imaging unit that images the pockets, and a control unit that measures a formation pitch of the pockets based on obtained image data, and changes a feed pitch of the carrier tape from the predetermined feed pitch to the formation pitch of the pockets when the measured formation pitch of the pockets and the predetermined feed pitch are different from each other, and the component supply device intermittently feeds the carrier tape based on the changed feed pitch.

公开(公告)号：US10863657B2

公开(公告)日：2020-12-08

申请号：US14768912

申请日：2014-02-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masayuki Higashi ,  Taisuke Mori ,  Ryouji Kouchi ,  Takuya Yamazaki ,  Hisashi Maezono ,  Hiroshi Ando

IPC: H05K13/00 ,  B65G15/12 ,  B65G15/24 ,  B65G15/22 ,  H05K13/08

Abstract: An electronic component mounting method is performed by an electronic component mounting system including a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The electronic component mounting method comprises mixedly distributing the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line.