Invention Grant
- Patent Title: Pre-layer defect site review using design
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Application No.: US15183919Application Date: 2016-06-16
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Publication No.: US09940704B2Publication Date: 2018-04-10
- Inventor: Arpit Yati
- Applicant: KLA-TENCOR CORPORATION
- Applicant Address: US CA Milpitas
- Assignee: KLA—Tencor Corporation
- Current Assignee: KLA—Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Priority: IN3079/CHE/2015 20150619
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/33 ; G06K9/00
Abstract:
A system and method to image a layer of a wafer based on a coordinate of a defect in a pre-layer of the wafer are disclosed. A design file for the current layer can be aligned to the wafer using an image of the current layer. A design file for a previous layer can be aligned to the design file for the current layer.
Public/Granted literature
- US20160371831A1 PRE-LAYER DEFECT SITE REVIEW USING DESIGN Public/Granted day:2016-12-22
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