- 专利标题： Manufacturing method and fluid supply system for treating substrate
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申请号： US15350983申请日： 2016-11-14
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公开(公告)号： US09941110B2公开(公告)日： 2018-04-10
- 发明人: Jung-Min Oh , HyoSan Lee , YongSun Ko , KyoungSeob Kim , SeokHoon Kim , KunTack Lee , YongMyung Jun , Yong-Jhin Cho
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Gyoonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyoonggi-do
- 代理机构： Muir Patent Law, PLLC
- 优先权： KR10-2012-0012927 20120208
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/308 ; H01L21/67
摘要：
A method of manufacture and fluid supply system for treating a substrate is provided. The fluid supply system for treating a substrate may include a substrate dry part supplying a dry fluid to dry a rinse solution doped on a substrate; a dry fluid separation part retrieving a mixed fluid that the dry fluid and the rinse solution are mixed with each other during a dry process of the substrate from the substrate dry part and separating the dry fluid from the mixed fluid; and a dry fluid supply part resupplying the dry fluid separated from the dry fluid separation part to the substrate dry part.
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