Invention Grant
- Patent Title: Electronic assembly that includes stacked electronic devices
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Application No.: US14648998Application Date: 2014-07-02
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Publication No.: US09941246B2Publication Date: 2018-04-10
- Inventor: Nitin Deshpande , Ravi V. Mahajan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2014/045217 WO 20140702
- International Announcement: WO2016/003456 WO 20160107
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L25/065 ; H01L21/52 ; H01L21/768 ; H01L23/04 ; H01L49/02

Abstract:
An electronic assembly that includes a first electronic device. The first electronic device includes a cavity that extends into a back side of the first electronic device. The electronic assembly further includes a second electronic device. The second electronic device is mounted to the first electronic device within the cavity in the first electronic device. In some example forms of the electronic assembly, the first electronic device and the second electronic device are each a die. It should be noted that other forms of the electronic assembly are contemplated where only one of the first electronic device and the second electronic device is a die. In some forms of the electronic assembly, the second electronic device is soldered to the first electronic device.
Public/Granted literature
- US20160260688A1 ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES Public/Granted day:2016-09-08
Information query
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