- 专利标题: Electronic assembly that includes stacked electronic devices
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申请号: US14648998申请日: 2014-07-02
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公开(公告)号: US09941246B2公开(公告)日: 2018-04-10
- 发明人: Nitin Deshpande , Ravi V. Mahajan
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 国际申请: PCT/US2014/045217 WO 20140702
- 国际公布: WO2016/003456 WO 20160107
- 主分类号: H01L25/00
- IPC分类号: H01L25/00 ; H01L25/065 ; H01L21/52 ; H01L21/768 ; H01L23/04 ; H01L49/02
摘要:
An electronic assembly that includes a first electronic device. The first electronic device includes a cavity that extends into a back side of the first electronic device. The electronic assembly further includes a second electronic device. The second electronic device is mounted to the first electronic device within the cavity in the first electronic device. In some example forms of the electronic assembly, the first electronic device and the second electronic device are each a die. It should be noted that other forms of the electronic assembly are contemplated where only one of the first electronic device and the second electronic device is a die. In some forms of the electronic assembly, the second electronic device is soldered to the first electronic device.
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