Invention Grant
- Patent Title: Flexible printed circuit board
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Application No.: US14930866Application Date: 2015-11-03
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Publication No.: US09942979B2Publication Date: 2018-04-10
- Inventor: Kyung-wan Park , Shi-yun Cho , Hyo-young Lee , Hyun-jung Kim , Mee-ree Kim , Ik-joon Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Applicant Address: KR Suwon-si KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Current Assignee Address: KR Suwon-si KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0031960 20150306
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; B32B7/04 ; B32B27/08 ; B32B27/28 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; B32B27/40 ; B32B3/08 ; H05K1/09 ; H05K3/38

Abstract:
A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates.
Public/Granted literature
- US20160128182A1 FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2016-05-05
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