Invention Grant
- Patent Title: Methods for gate formation in circuit structures
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Application No.: US15437837Application Date: 2017-02-21
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Publication No.: US09947545B2Publication Date: 2018-04-17
- Inventor: Xintuo Dai , Jiong Li
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Stephen Scuderi
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/283 ; H01L21/308 ; H01L21/306

Abstract:
Methods for forming a gate structure of a circuit structure are provide. The methods for forming the gate structure may include: forming a first gate pattern in a gate mask layer, the forming including a first etching of rounded corner portions of the first gate pattern; forming a second gate pattern in the gate mask layer, the second gate pattern at least partially overlapping the first gate pattern, the forming including a second etching of rounded corner portions of the second gate pattern; and, etching the gate mask layer using the first gate pattern and second gate pattern to form the gate structure.
Public/Granted literature
- US20170243748A1 METHODS FOR GATE FORMATION IN CIRCUIT STRUCTURES Public/Granted day:2017-08-24
Information query
IPC分类: