Invention Grant
- Patent Title: Semiconductor structure having dielectric layer and conductive strip
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Application No.: US14331303Application Date: 2014-07-15
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Publication No.: US09947665B2Publication Date: 2018-04-17
- Inventor: Chih-Wei Hu , Teng-Hao Yeh
- Applicant: Macronix International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L27/10
- IPC: H01L27/10 ; H01L27/115 ; H01L27/11582 ; H01L27/11565 ; H01L27/1157

Abstract:
A semiconductor structure is provided. The semiconductor structure includes a conductive strip, a conductive layer, a first dielectric layer, and a second dielectric layer. The first dielectric layer is between the conductive strip and the conductive layer arranged in a crisscross manner. The second dielectric layer is different from the first dielectric layer. The second dielectric layer and the first dielectric layer are adjoined with the conductive strip in different positions on the same sidewall of the conductive strip.
Public/Granted literature
- US20160020167A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2016-01-21
Information query
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