A layer structure having at least one metal element and at least one polyamide layer arranged at least regionally on the metal element, the structure preferably comprising an insulated electrical conductor wherein The polyamide layer consists of a polyamide molding composition consisting of the following components: (a) a polyamide based on cycloaliphatic diamines or cycloaliphatic dicarboxylic acids having a glass transition temperature (Tg) of at 130° C.; (b) a polyolefin based on C2-C12 alkenes, and additionally on at least one monomer selected from the following group: maleic anhydride, itaconic anhydride, glycidyl acrylate, butene, propylene, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C12 alkyl (meth)acrylates, substituted or unsubstituted styrene, or a mixture of such monomers; (c) optionally an aliphatic polyamide different from (a), or a mixture of such polyamides; (d) optionally additives.