Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, a crosslinking agent and a photopolymerization initiator, an organic electronic device having an encapsulant including the composition using a film-state product, that is, a curable pressure-sensitive adhesive film, including the composition, and a method of manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, the method includes assembling a photocurable pressure-sensitive adhesive film including an acrylic polymer, an epoxy resin, a crosslinking agent and a photopolymerization initiator with an top substrate; and assembling the top substrate to the bottom substrate on which an organic light-emitting element is formed to cover an entire surface of the organic light-emitting element with the curable pressure-sensitive adhesive layer, and radiating light only to an edge of the assembled top and bottom substrates in which the organic light-emitting element is not disposed to photocure. Therefore, mechanical strength may be ensured due to entire encapsulation, the simplification of a process by photocuring may be achieved without direct radiation of light to the organic light-emitting element, and lifespan of the element may be increased.